IDC 0,3/ 2-3,81 LC:BU/YE PCB terminal block

1038956

IDC 0,3/ 2-3,81 LC:BU/YE PCB terminal block

Manufactured by

Brand PHOENIX CONTACT

Printed circuit board terminal, nominal current: 5 A, rated voltage (III/2): 160 V, nominal cross section: 0.34 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: IDC 0,3, pitch: 3.81 mm, connection method: Displacement connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.4 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

4055626593623

only

available

100+

99999

pcs.

(2026-11-02)

Supply from Phoenix Contact’s warehouse

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0⁸⁶€ 0 € pcs.

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All prices with tax

inquiry

only

available

100+

inquiry

2026-11-02

pcs.

Properties

Description

Dimensions

Files

Codes

Nominal current IN

5 A

Product type

PCB terminal block

Printed circuit board terminal

Nominal voltage UN

160 V

Product family

IDC 0,3

Product line

COMBICON Terminals XS

Number of positions

Pitch

3.81 mm

Number of connections

Number of rows

Number of potentials

Pin layout

Linear pinning

Solder pins per potential

Nominal current I<sub>N</sub>

5 A

Nominal voltage U<sub>N</sub>

160 V

Rated voltage (III/3)

160 V

Rated surge voltage (III/3)

2.5 kV

Rated voltage (III/2)

160 V

Rated surge voltage (III/2)

2.5 kV

Rated voltage (II/2)

320 V

Rated surge voltage (II/2)

2.5 kV

Type

PC termination block

Nominal cross section

0.34 mm²

Connection method

Displacement connection

Conductor cross-section rigid

0.13 mm² ... 0.34 mm²

Conductor cross-section flexible

0.22 mm² ... 0.34 mm²

Conductor cross-section AWG

26 ... 22

Mounting type

Wave soldering

Note

WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201

Contact material

Cu alloy

Surface characteristics

tin-plated

Metal surface terminal point (top layer)

Tin (5 µm - 7 µm Sn)

Metal surface terminal point (middle layer)

Nickel (2 µm - 3 µm Ni)

Metal surface soldering area (top layer)

Tin (5 µm - 7 µm Sn)

Metal surface soldering area (middle layer)

Nickel (2 µm - 3 µm Ni)

Color (Housing)

green (6021)

Insulating material

Insulating material group

CTI according to IEC 60112

600

Flammability rating according to UL 94

Glow wire flammability index GWFI according to EN 60695-2-12

850

Glow wire ignition temperature GWIT according to EN 60695-2-13

775

Temperature for the ball pressure test according to EN 60695-10-2

125 °C

Width [w]

8.81 mm

Height [h]

22.2 mm

Length [l]

12.4 mm

Installed height

18.8 mm

Solder pin length [P]

3.4 mm

Pin dimensions

1 x 0.4 mm

Hole diameter

1.3 mm

Specification

IEC 60664-1:2007-04

Length

Width

Height

Weight Net

Weight

Package

Volume

m³

76.49 Kb

pxc_1038956_00_00_IDC-0-3-2-3-81-LC-BU-YE_FAM.pdf

ECLASS-13.0

27460101

ECLASS-15.0

27460101

ETIM 10.0

EC002643

UNSPSC 21.0

39121400

GTIN

4055626593623

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IDC 0,3/ 2-3,81 LC:BU/YE PCB terminal block

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