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FP 0,8/ 32-MV-SH 2,65 SMD male connector, shielded
N
0%
1043733

FP 0,8/ 32-MV-SH 2,65 SMD male connector, shielded

Manufactured by
Brand PHOENIX CONTACT
shielded SMD male connector, nominal current: 1.7 A, test voltage: 500 V AC, number of positions: 32, pitch: 0.8 mm, color: black, contact surface: Au, contact connection type: Pin, mounting: SMD soldering
4055626608365
only
available
100+
3500
pcs.
(2026-08-29)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
479 0 € pcs.
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only
available
100+
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0
2026-08-29
pcs.
Properties
Description
Dimensions
Files
Codes
Nominal current IN
1.7 A IEC 60512-5-2:2002-02 (at 20°C 80-pos.)
Product type
shielded SMD male connector
Classification temperature Tc
260 °C
Product family
FP 0,8/...-MV-SH 2,65
Contact resistance R1
15 mΩ
Number of positions
32
Contact resistance R2
15 mΩ
Pitch
0.8 mm
Number of rows
2
Pin layout
Linear pad geometry
Electrical characteristic
shielded
Nominal current I<sub>N</sub>
1.7 A IEC 60512-5-2:2002-02 (at 20°C 80-pos.)
Contact resistance
15 mΩ
Test voltage
500 V AC IEC 60512-4-1:2003-05
Data transmission rate
16 Gbps
Mounting type
SMD soldering
Process
Reflow soldering
Moisture Sensitive Level
MSL 1
Classification temperature T<sub>c</sub>
260 °C
Solder cycles in the reflow
3
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
Selective coating
Metal surface contact area (top layer)
Gold (min. 0.5 µm Au)
Metal surface contact area (middle layer)
Nickel (1.27 µm - 4 µm Ni)
Metal surface soldering area (top layer)
Tin (2 µm - 6 µm Sn)
Metal surface soldering area (middle layer)
Nickel (1.27 µm - 4 µm Ni)
Color (Housing)
black (9005)
Insulating material
LCP
Insulating material group
IIIb
CTI according to IEC 60112
150
Flammability rating according to UL 94
V0
Notes on operation
The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1.
Details for soldering processes
The items are suitable for assembly on both sides and for overhead soldering.
Width [w]
16.7 mm
Height [h]
7.75 mm
Length [l]
6.1 mm
Installed height
7.15 mm
Contact cover
0.8 mm
Center offset
± 0.7 mm in longitudinal and transverse direction
Stack height
Wipe length
1.5 mm
Angular tolerance
± 5 ° in longitudinal and transverse direction (when plugging in)
Axial offset in X direction (longitudinal)
± 0.3 mm (Tolerance compensation when plugged in)
Axial offset in Y direction (transversal)
± 0.3 mm (Tolerance compensation when plugged in)
Pad geometry
0.5 x 1.1 mm
Specification
DIN EN 50155 (VDE 0115-200):2022-06
IEC 60068-2-27:2008-02
IEC 60068-2-6:2007-12
IEC 60512-11-7:2003-05
IEC 60512-3-1:2002-02
IEC 60512-5-2:2002-02
IEC 60512-9-1:2010-03 (following)
IEC 61373:2010-05
Tested number of positions
80
Insulation resistance, neighboring positions
≥ 5 GΩ
Minimum value for clearance and creepage distance
0.25 mm
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
ECLASS-13.0
27460201
ECLASS-15.0
27460201
ETIM 10.0
EC002637
UNSPSC 21.0
39121400
GTIN
4055626608365
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