CUC-SP-J1ST-A/R4LT-SMD-LED Modular RJ45 PCB connectors

1149873

CUC-SP-J1ST-A/R4LT-SMD-LED Modular RJ45 PCB connectors

Manufactured by

Brand PHOENIX CONTACT

Modular RJ45 PCB connectors, 1x1 single-port, connection direction of the connector to the PCB: 90 °, Tab up, Shielded, LED (green, yellow), number of positions: 8, 10 Gbps, PoE++, SMT, SMD, Reflow, IP20, type of packaging: Tape and Reel

4063151145569

only

available

100+

6400

pcs.

(2026-08-29)

Supply from Phoenix Contact’s warehouse

Product recommended retail price (RRP) is

0⁰⁰€

2³⁴€ 0 € pcs.

All prices without tax

All prices with tax

inquiry

only

available

100+

inquiry

2026-08-29

pcs.

Properties

Description

Dimensions

Files

Codes

Connection profile

RJ45

Slots

1x1 single-port

Orientation to PCB

90.00 °

Type

SMD

Number of positions

8 (8P8C)

Type of locking

Snap-in locking, Tab up

Shielding

Shielded

Status display

LED (green, yellow)

Processing notes

Reflow

Type of packaging

Tape and Reel

Transmission speed

10 Gbps

Power transmission

PoE++ (according to IEEE 802.3bt)

Power PSE

90 W (Class 8 in accordance with IEEE 802.3bt)

Power PD

71 W (Class 4 in accordance with IEEE 802.3bt)

Pollution degree

2 (IEC 60664-1)

Overvoltage category

I (IEC 60664-1)

Rated voltage

72 V DC

Rated surge voltage

1.5 kV DC (IEC 60664-1)

Rated current

1.5 A (IEC 60603-7)

Insulation resistance

> 500 MΩ (IEC 60603-7)

Test voltage (Contact/contact)

1.5 kV DC (IEC 60603-7)

Test voltage (Contact/shield)

1.5 kV DC (IEC 60603-7)

Length

15.75 mm

Width

18.8 mm

Height

14.8 mm

Installed height

13.50 mm

Material Contact carrier

Flame resistance

UL 94 V0

Halogen-free

Material Housing

Copper alloy

Material Housing coating

Ni (0,508 µm / 20 µ")

Material Housing pin coating (top layer/selective)

Ni (0,508 µm / 20 µ")

Material Contact

Phosphor bronze

Material Solder contact coating (intermediate layer)

Ni (1.27 µm/50 µ")

Material Solder contact coating (top layer/selective)

Au (Flash)

Material Plug contact coating (top layer/selective)

Au (0,152 µm / 6 µ")

Material Plug contact coating (intermediate layer)

Ni (1.27 µm/50 µ")

Insertion/withdrawal cycles

> 750 (IEC 60603-7)

Insertion force

< 20 N (IEC 60603-7)

Withdrawal force

< 20 N (IEC 60603-7)

Ambient temperature (operation)

-40 °C ... 85 °C

Ambient temperature (storage/transport)

-40 °C ... 85 °C

Degree of protection (plugged in)

IP20 (IEC 60603-7)

Degree of protection (not plugged in)

IP20 (IEC 60603-7)

Acceleration

50 m/s²

Amplitude

0.35 mm

Sweep speed

1 octave/min

Mounting type

SMT

Moisture Sensitive Level

MSL 1 (IEC 60068-2-58)

Solder cycles in the reflow

3 (IEC 60068-2-58)

Length

Width

Height

Weight Net

Weight

Package

Volume

m³

No files found

ECLASS-13.0

27460201

ECLASS-15.0

27460201

ETIM 10.0

EC002637

UNSPSC 21.0

39121400

GTIN

4063151145569

No item accessories found

No related items found

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CUC-SP-J1ST-A/R4LT-SMD-LED Modular RJ45 PCB connectors

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