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CUC-MP-J1ST-A/2R4LT-THR-LED Modular RJ45 PCB connectors
N
0%
1337254

CUC-MP-J1ST-A/2R4LT-THR-LED Modular RJ45 PCB connectors

Manufactured by
Brand PHOENIX CONTACT
Modular RJ45 PCB connectors, 1x2 multi-port, connection direction of the connector to the PCB: 90 °, Tab up, Shielded, shield springs, LED (green, yellow), number of positions: 8, 10 Gbps, PoE++, THT-THR, THD, Reflow, IP20, type of packaging: Tape and Reel
4063151638450
only
available
100+
400
pcs.
(2026-08-29)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
436 0 € pcs.
All prices without tax
All prices with tax
inquiry
only
available
100+
inquiry
0
2026-08-29
pcs.
Properties
Description
Dimensions
Files
Codes
Connection profile
RJ45
Slots
1x2 multi-port
Orientation to PCB
90.00 °
Type
THD
Number of positions
8 (8P8C)
Type of locking
Snap-in locking, Tab up
Shielding
Shielded, shield springs
Status display
LED (green, yellow)
Processing notes
Reflow
Type of packaging
Tape and Reel
Transmission speed
10 Gbps
Power transmission
PoE++ (according to IEEE 802.3bt)
Power PSE
90 W (Class 8 in accordance with IEEE 802.3bt)
Power PD
71 W (Class 4 in accordance with IEEE 802.3bt)
Pollution degree
2 (IEC 60664-1)
Overvoltage category
I (IEC 60664-1)
Rated voltage
72 V DC
Rated surge voltage
1.5 kV DC (IEC 60664-1)
Rated current
1.5 A (IEC 60603-7)
Insulation resistance
> 500 MΩ (IEC 60603-7)
Test voltage (Contact/contact)
1.5 kV DC (IEC 60603-7)
Test voltage (Contact/shield)
1.5 kV DC (IEC 60603-7)
Length
16.5 mm
Width
35.5 mm
Height
18.2 mm
Installed height
13.60 mm
Data pin length
2.00 mm
Material Contact carrier
LCP
Flame resistance
UL 94 V0
Halogen-free
yes
Material Housing
Stainless steel
Material Housing pin coating (top layer/selective)
Sn
Material Contact
Phosphor bronze
Material Solder contact coating (intermediate layer)
Ni (1.27 µm/50 µ")
Material Solder contact coating (top layer/selective)
Sn (2.54 µm / 100 µ")
Material Plug contact coating (top layer/selective)
Au (1.27 µm/50 µ")
Material Plug contact coating (intermediate layer)
Ni (1.27 µm/50 µ")
Insertion/withdrawal cycles
> 750 (IEC 60603-7)
Insertion force
< 20 N (IEC 60603-7)
Withdrawal force
< 20 N (IEC 60603-7)
Ambient temperature (operation)
-50 °C ... 85 °C
Ambient temperature (storage/transport)
-50 °C ... 85 °C
Degree of protection (plugged in)
IP20 (IEC 60603-7)
Degree of protection (not plugged in)
IP20 (IEC 60603-7)
Acceleration
50 m/s²
Amplitude
0.35 mm
Sweep speed
1 octave/min
Mounting type
THT-THR
Moisture Sensitive Level
MSL 1 (IEC 60068-2-58)
Solder cycles in the reflow
3 (IEC 60068-2-58)
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
No files found
ECLASS-13.0
27460201
ECLASS-15.0
27460201
ETIM 10.0
EC002637
UNSPSC 21.0
39121400
GTIN
4063151638450
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