1706875

MCD 1,5/12-G1-3,81 OG PCB header

Manufactured by

Brand PHOENIX CONTACT

PCB headers, nominal cross section: 1.5 mm², color: orange, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 24, number of rows: 2, number of positions: 12, number of connections: 24, product range: MCD 1,5/..-G1, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard

4046356033589

only

available

100+

99999

pcs.

(2026-09-17)

Supply from Phoenix Contact’s warehouse

Product recommended retail price (RRP) is

0⁰⁰€

8²⁷€ 0 € pcs.

All prices without tax

All prices with tax

inquiry

only

available

100+

inquiry

2026-09-17

pcs.

Properties

Description

Dimensions

Files

Codes

Nominal current IN

8 A

Product type

PCB headers

Nominal voltage UN

160 V

Product family

MCD 1,5/..-G1

Contact holder in insertRequirements >20 N

Test passed

Product line

COMBICON Connectors S

Contact resistance R1

1.2 mΩ

Number of positions

Contact resistance R2

1.3 mΩ

Pitch

3.81 mm

Contact resistance R2 2nd level

2.2 mΩ

Number of connections

Number of rows

Number of potentials

Mounting type

Wave soldering

without

Pin layout

Linear pinning

Solder pins per potential

Nominal current I_N

8 A

Nominal voltage U_N

160 V

Contact resistance

1.2 mΩ

Rated voltage (III/3)

160 V

Rated surge voltage (III/3)

2.5 kV

Rated voltage (III/2)

160 V

Rated surge voltage (III/2)

2.5 kV

Rated voltage (II/2)

320 V

Rated surge voltage (II/2)

2.5 kV

Note

WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201

Contact material

Cu alloy

Surface characteristics

tin-plated

Metal surface contact area (top layer)

Tin (3 µm - 5 µm Sn)

Metal surface contact area (middle layer)

Nickel (1 µm - 3 µm Ni)

Metal surface soldering area (top layer)

Tin (3 µm - 5 µm Sn)

Metal surface soldering area (middle layer)

Nickel (1 µm - 3 µm Ni)

Color (Housing)

orange (2003)

Insulating material

Insulating material group

CTI according to IEC 60112

600

Flammability rating according to UL 94

Glow wire flammability index GWFI according to EN 60695-2-12

850

Glow wire ignition temperature GWIT according to EN 60695-2-13

775

Temperature for the ball pressure test according to EN 60695-10-2

125 °C

Width [w]

47.11 mm

Height [h]

26.5 mm

Length [l]

21.9 mm

Installed height

23 mm

Solder pin length [P]

3.5 mm

Pin dimensions

0.8 x 0.8 mm

Hole diameter

1.2 mm

Specification

IEC 60068-2-6:2007-12

IEC 60068-2-70:1995-12

IEC 60512-1-1:2002-02

IEC 60512-1-2:2002-02

IEC 60512-13-2:2006-02

IEC 60512-13-5:2006-02

IEC 60512-15-1:2008-05

IEC 60512-3-1:2002-02

IEC 60512-5-1:2002-02

IEC 60512-9-1:2010-03

IEC 60664-1:2007-04

ISO 6988:1985-02

Result

Test passed

Length

Width

Height

Weight Net

Weight

Package

Volume

m³

No files found

ECLASS-13.0

27460201

ECLASS-15.0

27460201

ETIM 10.0

EC002637

UNSPSC 21.0

39121400

GTIN

4046356033589

No item accessories found

No related items found

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MCD 1,5/12-G1-3,81 OG PCB header

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