1772899

MC 1,5/21-GF-3,81 GY7004 PCB header

Manufactured by

Brand PHOENIX CONTACT

PCB headers, nominal cross section: 1.5 mm², nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of rows: 1, number of positions: 21, product range: MC 1,5/..-GF, pitch: 3.81 mm, mounting: Wave soldering, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting method: Threaded flange

4067923386174

only

available

100+

99999

pcs.

(2026-11-29)

Supply from Phoenix Contact’s warehouse

Product recommended retail price (RRP) is

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4⁷⁶€ 0 € pcs.

All prices without tax

All prices with tax

inquiry

only

available

100+

inquiry

2026-11-29

pcs.

Properties

Description

Dimensions

Files

Codes

Nominal current IN

8 A

Product type

PCB headers

Nominal voltage UN

160 V

Product family

MC 1,5/..-GF

Product line

COMBICON Connectors S

Number of positions

Pitch

3.5 mm

3.81 mm

Number of rows

Solder pins per potential

Nominal current I_N

8 A

Nominal voltage U_N

160 V

Rated voltage (III/3)

160 V

Rated surge voltage (III/3)

2.5 kV

Rated voltage (III/2)

160 V

Rated surge voltage (III/2)

2.5 kV

Rated voltage (II/2)

250 V

Rated surge voltage (II/2)

2.5 kV

Mounting type

Wave soldering

Tightening torque

0.3 Nm

Note

WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201

Contact material

Cu alloy

Surface characteristics

tin-plated

Metal surface contact area (top layer)

Tin (3 µm - 5 µm Sn)

Metal surface contact area (middle layer)

Nickel (1.3 µm - 3 µm Ni)

Metal surface soldering area (top layer)

Tin (3 µm - 5 µm Sn)

Metal surface soldering area (middle layer)

Nickel (1.3 µm - 3 µm Ni)

Insulating material

Insulating material group

CTI according to IEC 60112

600

Flammability rating according to UL 94

Glow wire flammability index GWFI according to EN 60695-2-12

850

Glow wire ignition temperature GWIT according to EN 60695-2-13

775

Temperature for the ball pressure test according to EN 60695-10-2

125 °C

Pin dimensions

0.8 x 0.8 mm

Specification

IEC 60664-1:2007-04

Comparative tracking index (IEC 60112)

CTI 600

Rated insulation voltage (III/3)

160 V

minimum clearance value - non-homogenous field (III/3)

1.5 mm

minimum creepage distance (III/3)

2 mm

Rated insulation voltage (III/2)

160 V

minimum clearance value - non-homogenous field (III/2)

1.5 mm

minimum creepage distance (III/2)

1.5 mm

Rated insulation voltage (II/2)

250 V

minimum clearance value - non-homogenous field (II/2)

1.5 mm

minimum creepage distance (II/2)

1.5 mm

Ambient temperature (storage/transport)

-40 °C ... 70 °C

Relative humidity (storage/transport)

30 % ... 70 %

Ambient temperature (assembly)

-5 °C ... 100 °C

Ambient temperature (operation)

-40 °C ... 100 °C (dependent on the derating curve)

Length

Width

Height

Weight Net

Weight

Package

Volume

m³

No files found

ECLASS-13.0

27460201

ECLASS-15.0

27460201

ETIM 10.0

EC002637

GTIN

4067923386174

No item accessories found

No related items found

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MC 1,5/21-GF-3,81 GY7004 PCB header

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