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MCV 1,5/ 6-G-3,5 P26 THRR56 PCB header
N
0%
1779459

MCV 1,5/ 6-G-3,5 P26 THRR56 PCB header

Manufactured by
Brand PHOENIX CONTACT
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: MCV 1,5/..-G-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: 56 mm wide tape, For user information and design recommendations for through-hole reflow technology, go to: Downloads
4046356531894
only
available
100+
6400
pcs.
(2026-08-29)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
186 0 € pcs.
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only
available
100+
inquiry
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2026-08-29
pcs.
Properties
Description
Dimensions
Files
Codes
Nominal current IN
8 A
Product type
PCB headers
Nominal voltage UN
160 V
Product family
MCV 1,5/..-G-THR
Classification temperature Tc
260 °C
Product line
COMBICON Connectors S
Contact holder in insertRequirements >20 N
Test passed
Type
Component suitable for through hole reflow
Contact resistance R1
1.6 mΩ
Number of positions
6
Contact resistance R2
1.7 mΩ
Pitch
3.5 mm
Number of connections
6
Number of rows
1
Number of potentials
6
Mounting type
THR soldering / wave soldering
without
Pin layout
Linear pinning
Solder pins per potential
1
Nominal current I<sub>N</sub>
8 A
Nominal voltage U<sub>N</sub>
160 V
Contact resistance
1.6 mΩ
Rated voltage (III/3)
160 V
Rated surge voltage (III/3)
2.5 kV
Rated voltage (III/2)
160 V
Rated surge voltage (III/2)
2.5 kV
Rated voltage (II/2)
250 V
Rated surge voltage (II/2)
2.5 kV
Process
Reflow/wave soldering
Moisture Sensitive Level
MSL 1
Classification temperature T<sub>c</sub>
260 °C
Solder cycles in the reflow
3
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
tin-plated
Metal surface contact area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface contact area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Metal surface soldering area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface soldering area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Color (Housing)
black (9005)
Insulating material
LCP
Insulating material group
IIIa
CTI according to IEC 60112
175
Flammability rating according to UL 94
V0
Width [w]
22.4 mm
Height [h]
11.8 mm
Length [l]
6.9 mm
Installed height
9.2 mm
Solder pin length [P]
2.6 mm
Pin dimensions
0.8 x 0.8 mm
Hole diameter
1.4 mm
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
No files found
ECLASS-13.0
27460201
ECLASS-15.0
27460201
ETIM 10.0
EC002637
UNSPSC 21.0
39121400
GTIN
4046356531894
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