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PTSM 0,5/ 4-HHI1-2,5-THR R32 PCB header
N
0%
1810803

PTSM 0,5/ 4-HHI1-2,5-THR R32 PCB header

Manufactured by
Brand PHOENIX CONTACT
PCB headers, nominal cross section: 0.5 mm2, color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Socket, number of potentials: 4, number of rows: 1, number of positions: 4, number of connections: 4, product range: PTSM 0,5/..-HHI-THR, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.1 mm, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: 32 mm wide tape, Article with anti-rotation pin
4046356707336
only
available
100+
1500
pcs.
(2026-08-29)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
105 0 € pcs.
All prices without tax
All prices with tax
inquiry
only
available
100+
inquiry
0
2026-08-29
pcs.
Properties
Description
Dimensions
Files
Codes
Nominal current IN
6 A
Product type
PCB headers
Nominal voltage UN
160 V
Product family
PTSM 0,5/..-HHI-THR
Classification temperature Tc
260 °C
Product line
COMBICON Connectors XS
Contact holder in insertRequirements >20 N
Test passed
Type
Component suitable for through hole reflow
Contact resistance R1
3.3 mΩ
Number of positions
4
Contact resistance R2
3.5 mΩ
Pitch
2.5 mm
Number of connections
4
Number of rows
1
Number of potentials
4
Mounting type
THR soldering
without
Pin layout
Linear pinning
Solder pins per potential
1
Nominal current I<sub>N</sub>
6 A
Nominal voltage U<sub>N</sub>
160 V
Contact resistance
3.3 mΩ
Rated voltage (III/3)
63 V
Rated surge voltage (III/3)
2.5 kV
Rated voltage (III/2)
160 V
Rated surge voltage (III/2)
2.5 kV
Rated voltage (II/2)
200 V
Rated surge voltage (II/2)
2.5 kV
Process
Reflow/wave soldering
Moisture Sensitive Level
MSL 1
Classification temperature T<sub>c</sub>
260 °C
Solder cycles in the reflow
3
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
Selective coating
Metal surface contact area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface contact area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Metal surface soldering area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface soldering area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Color (Housing)
black (9005)
Insulating material
LCP
Insulating material group
IIIa
CTI according to IEC 60112
175
Flammability rating according to UL 94
V0
Width [w]
10.5 mm
Height [h]
7.1 mm
Length [l]
12 mm
Installed height
5 mm
Solder pin length [P]
2.1 mm
Hole diameter
1 mm
Specification
IEC 60068-2-6:2007-12
IEC 60068-2-70:1995-12
IEC 60512-1-1:2002-02
IEC 60512-1-2:2002-02
IEC 60512-13-2:2006-02
IEC 60512-13-5:2006-02
IEC 60512-15-1:2008-05
IEC 60512-3-1:2002-02
IEC 60512-5-1:2002-02
IEC 60512-9-1:2010-03
IEC 60664-1:2007-04
ISO 6988:1985-02
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
No files found
ECLASS-13.0
27460201
ECLASS-15.0
27460201
ETIM 10.0
EC002637
UNSPSC 21.0
39121400
GTIN
4046356707336
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