1845182

DMCV 0,5/ 3-G1-2,54 SMD R24 PCB header

Manufactured by

Brand PHOENIX CONTACT

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Au, contact connection type: Pin, number of potentials: 6, number of rows: 2, number of positions: 3, number of connections: 6, product range: DMCV 0,5/..-G1-SMD, pitch: 2.54 mm, mounting: SMD soldering, pin layout: Linear pad geometry, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: 24 mm wide tape

4046356965019

only

available

100+

99999

pcs.

(2026-10-05)

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only

available

100+

inquiry

2026-10-05

pcs.

Properties

Description

Dimensions

Files

Codes

Nominal current IN

6 A

Product type

PCB headers

Nominal voltage UN

160 V

Product family

DMCV 0,5/..-G1-SMD

Classification temperature Tc

260 °C

Product line

COMBICON Connectors XS

Contact holder in insertRequirements >20 N

Test passed

Number of positions

Contact resistance R1

2.5 mΩ

Pitch

2.54 mm

Contact resistance R2

2.7 mΩ

Number of connections

Contact resistance R2 2nd level

2.7 mΩ

Number of rows

Number of potentials

Mounting type

SMD soldering

without

Pin layout

Linear pad geometry

Solder pins per potential

Nominal current IN

6 A

Nominal voltage UN

160 V

Contact resistance

2.5 mΩ

Rated voltage (III/3)

32 V

Rated surge voltage (III/3)

2.5 kV

Rated voltage (III/2)

160 V

Rated surge voltage (III/2)

2.5 kV

Rated voltage (II/2)

160 V

Rated surge voltage (II/2)

2.5 kV

Process

Reflow soldering

Moisture Sensitive Level

MSL 1

Classification temperature Tc

260 °C

Solder cycles in the reflow

Note

WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201

Contact material

Cu alloy

Surface characteristics

Completely gold-plated

Metal surface contact area (top layer)

Gold (min. 0.25 µm Au)

Metal surface contact area (middle layer)

Nickel (2 µm - 4 µm Ni)

Metal surface soldering area (top layer)

Gold (0.25 µm Au)

Metal surface soldering area (middle layer)

Nickel (2 µm - 4 µm Ni)

Color (Housing)

black (9005)

Insulating material

LCP

Insulating material group

IIIa

CTI according to IEC 60112

175

Flammability rating according to UL 94

Width [w]

12.2 mm

Height [h]

7.1 mm

Length [l]

7.39 mm

Pin dimensions

0.64 x 0.64 mm

Pad geometry

1.2 x 2.85 mm

Pin spacing

2.54 mm

Specification

DIN 50018:2013-05

IEC 60068-2-6:2007-12

IEC 60068-2-70:1995-12

IEC 60512-1-1:2002-02

IEC 60512-1-2:2002-02

IEC 60512-13-2:2006-02

IEC 60512-13-5:2006-02

IEC 60512-15-1:2008-05

IEC 60512-3-1:2002-02

IEC 60512-5-1:2002-02

IEC 60512-9-1:2010-03

IEC 60664-1:2007-04

Length

Width

Height

Weight Net

Weight

Package

Volume

m³

No files found

ECLASS-13.0

27460201

ECLASS-15.0

27460201

ETIM 10.0

EC002637

UNSPSC 21.0

39121400

GTIN

4046356965019

1844581 DFMC 0,5/ 3-ST-2,54 PCB connector

3²⁵€ 0 €

only

available

100+

inquiry

2026-10-07

pcs.

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DMCV 0,5/ 3-G1-2,54 SMD R24 PCB header

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