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MCDNV 1,5/16-G1-3,5 RNP14THR PCB header
N
0%
1952649

MCDNV 1,5/16-G1-3,5 RNP14THR PCB header

Manufactured by
Brand PHOENIX CONTACT
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 32, number of rows: 2, number of positions: 16, number of connections: 32, product range: MCDNV 1,5/..-G1-RN-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 1,5 - MCDN 1,5, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting method: Engagement nose, type of packaging: packed in cardboard, Article with engagement nose. The pin length is 14 mm. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"
4017918919757
only
available
100+
99999
pcs.
(2026-09-17)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
1070 0 € pcs.
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only
available
100+
inquiry
0
2026-09-17
pcs.
Properties
Description
Dimensions
Files
Codes
Nominal current IN
8 A
Product type
PCB headers
Nominal voltage UN
160 V
Product family
MCDNV 1,5/..-G1-RN-THR
Contact holder in insertRequirements >20 N
Test passed
Product line
COMBICON Connectors S
Contact resistance R1
1.8 mΩ
Type
Component suitable for through hole reflow
Contact resistance R2
2 mΩ
Number of positions
16
Pitch
3.5 mm
Number of connections
32
Number of rows
2
Number of potentials
32
Mounting type
Engagement nose
THR soldering / wave soldering
Pin layout
Linear pinning
Solder pins per potential
1
Nominal current I<sub>N</sub>
8 A
Nominal voltage U<sub>N</sub>
160 V
Contact resistance
1.8 mΩ
Rated voltage (III/3)
160 V
Rated surge voltage (III/3)
2.5 kV
Rated voltage (III/2)
160 V
Rated surge voltage (III/2)
2.5 kV
Rated voltage (II/2)
250 V
Rated surge voltage (II/2)
2.5 kV
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
tin-plated
Metal surface contact area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface contact area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Metal surface soldering area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface soldering area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Color (Housing)
black (9005)
Insulating material
LCP
Insulating material group
IIIa
CTI according to IEC 60112
175
Flammability rating according to UL 94
V0
Details for soldering processes
Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)<br/>Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C
Width [w]
59.7 mm
Height [h]
14.7 mm
Length [l]
15.2 mm
Installed height
13.3 mm
Solder pin length [P]
1.4 mm
Pin dimensions
0.8 x 0.8 mm
Pin spacing
8.30 mm
Hole diameter
1.4 mm
Specification
IEC 60068-2-6:2007-12
IEC 60068-2-70:1995-12
IEC 60512-1-1:2002-02
IEC 60512-1-2:2002-02
IEC 60512-13-2:2006-02
IEC 60512-13-5:2006-02
IEC 60512-15-1:2008-05
IEC 60512-3-1:2002-02
IEC 60512-5-1:2002-02
IEC 60512-9-1:2010-03
IEC 60664-1:2007-04
ISO 6988:1985-02
Result
Test passed
Contact holder in insert&lt;br/&gt;Requirements &gt;20 N
Test passed
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
No files found
ECLASS-13.0
27460201
ECLASS-15.0
27460201
ETIM 10.0
EC002637
UNSPSC 21.0
39121400
GTIN
4017918919757
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