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MCDN 1,5/ 2-G1-3,5 P14THR PCB header
N
0%
1953907

MCDN 1,5/ 2-G1-3,5 P14THR PCB header

Manufactured by
Brand PHOENIX CONTACT
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 4, number of rows: 2, number of positions: 2, number of connections: 4, product range: MCDN 1,5/..-G1-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 1.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 1,5 - MCDN 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: packed in cardboard, The pin length is 1.4 mm. User information and design recommendations on Through Hole Reflow Technology can be found at: Downloads".
4017918919078
only
available
100+
95
pcs.
(2026-08-31)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
230 0 € pcs.
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available
100+
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2026-08-31
pcs.
Properties
Description
Dimensions
Files
Codes
Nominal current IN
8 A
Product type
PCB headers
Nominal voltage UN
160 V
Product family
MCDN 1,5/..-G1-THR
Classification temperature Tc
260 °C
Product line
COMBICON Connectors S
Contact holder in insertRequirements >20 N
Test passed
Type
Component suitable for through hole reflow
Contact resistance R1
2.1 mΩ
Number of positions
2
Contact resistance R2
2.4 mΩ
Pitch
3.5 mm
Number of connections
4
Number of rows
2
Number of potentials
4
Mounting type
THR soldering / wave soldering
without
Pin layout
Linear pinning
Solder pins per potential
1
Nominal current I<sub>N</sub>
8 A
Nominal voltage U<sub>N</sub>
160 V
Contact resistance
2.1 mΩ
Rated voltage (III/3)
160 V
Rated surge voltage (III/3)
2.5 kV
Rated voltage (III/2)
160 V
Rated surge voltage (III/2)
2.5 kV
Rated voltage (II/2)
250 V
Rated surge voltage (II/2)
2.5 kV
Process
Reflow/wave soldering
Moisture Sensitive Level
MSL 1
Classification temperature T<sub>c</sub>
260 °C
Solder cycles in the reflow
3
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
tin-plated
Metal surface contact area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface contact area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Metal surface soldering area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface soldering area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Color (Housing)
black (9005)
Insulating material
LCP
Insulating material group
IIIa
CTI according to IEC 60112
175
Flammability rating according to UL 94
V0
Details for soldering processes
Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)<br/>Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C
Width [w]
8.5 mm
Height [h]
15.2 mm
Length [l]
13.3 mm
Installed height
16 mm
Solder pin length [P]
1.4 mm
Pin dimensions
0.8 x 0.8 mm
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
No files found
ECLASS-13.0
27460201
ECLASS-15.0
27460201
ETIM 10.0
EC002637
UNSPSC 21.0
39121400
GTIN
4017918919078
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