1955646

CCV 2,5/ 3-GF-5,08 P26THR PCB header

Manufactured by

Brand PHOENIX CONTACT

PCB headers, nominal cross section: 2.5 mm², color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: CCV 2,5/..-GF, pitch: 5.08 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting method: Threaded flange, type of packaging: packed in cardboard, For user information and design recommendations for through-hole reflow technology, go to: Downloads

4017918926403

only

available

100+

1850

pcs.

(2026-08-29)

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only

available

100+

inquiry

2026-08-29

pcs.

Properties

Description

Dimensions

Files

Codes

Nominal current IN

12 A

Product type

PCB headers

Nominal voltage UN

320 V

Product family

CCV 2,5/..-GF

Classification temperature Tc

260 °C

Product line

COMBICON Connectors M

Contact holder in insertRequirements >20 N

Test passed

Type

Component suitable for through hole reflow

Contact resistance R1

0.9 mΩ

Number of positions

Contact resistance R2

1.2 mΩ

Pitch

5.08 mm

Number of connections

Number of rows

Number of potentials

Mounting type

THR soldering / wave soldering

Threaded flange

Pin layout

Linear pinning

Solder pins per potential

Nominal current IN

12 A

Nominal voltage UN

320 V

Contact resistance

0.9 mΩ

Rated voltage (III/3)

250 V

Rated surge voltage (III/3)

4 kV

Rated voltage (III/2)

320 V

Rated surge voltage (III/2)

4 kV

Rated voltage (II/2)

400 V

Rated surge voltage (II/2)

4 kV

Tightening torque

0.3 Nm

Process

Reflow/wave soldering

Moisture Sensitive Level

MSL 1

Classification temperature Tc

260 °C

Solder cycles in the reflow

Note

WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201

Contact material

Cu alloy

Surface characteristics

tin-plated

Metal surface contact area (top layer)

Tin (3 µm - 5 µm Sn)

Metal surface contact area (middle layer)

Nickel (1.3 µm - 3 µm Ni)

Metal surface soldering area (top layer)

Tin (3 µm - 5 µm Sn)

Metal surface soldering area (middle layer)

Nickel (1.3 µm - 3 µm Ni)

Color (Housing)

black (9005)

Insulating material

LCP

Insulating material group

IIIa

CTI according to IEC 60112

175

Flammability rating according to UL 94

Details for soldering processes

Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C

Width [w]

25.35 mm

Height [h]

14.6 mm

Length [l]

8.57 mm

Installed height

12 mm

Solder pin length [P]

2.6 mm

Length

Width