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MCV 1,5/ 2-G-3,81-THT P2,0 R32 PCB header
N
0%
1997808

MCV 1,5/ 2-G-3,81-THT P2,0 R32 PCB header

Manufactured by
Brand PHOENIX CONTACT
PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of rows: 1, number of positions: 2, product range: MCV 1,5/..-G-THT, pitch: 3.81 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting method: without, type of packaging: 32 mm wide tape, For user information and design recommendations for through-hole reflow technology, go to: Downloads
4046356038218
only
available
100+
99999
pcs.
(2026-09-23)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
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only
available
100+
inquiry
0
2026-09-23
pcs.
Properties
Description
Dimensions
Files
Codes
Nominal current IN
8 A
Product type
PCB headers
Nominal voltage UN
160 V
Product family
MCV 1,5/..-G-THT
Classification temperature Tc
260 °C
Type
Component suitable for through hole reflow
Contact holder in insertRequirements >20 N
Test passed
Number of positions
2
Contact resistance R1
1.4 mΩ
Pitch
3.81 mm
Contact resistance R2
1.5 mΩ
Number of rows
1
Mounting type
no
THR soldering / wave soldering
Pin layout
Linear pinning
Nominal current I<sub>N</sub>
8 A
Nominal voltage U<sub>N</sub>
160 V
Contact resistance
1.4 mΩ
Rated voltage (III/3)
160 V
Rated surge voltage (III/3)
2.5 kV
Rated voltage (III/2)
160 V
Rated surge voltage (III/2)
2.5 kV
Rated voltage (II/2)
320 V
Rated surge voltage (II/2)
2.5 kV
Process
Reflow/wave soldering
Moisture Sensitive Level
MSL 3
Classification temperature T<sub>c</sub>
260 °C
Solder cycles in the reflow
3
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material
Cu alloy
Surface characteristics
tin-plated
Metal surface contact area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface contact area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Metal surface soldering area (top layer)
Tin (3 µm - 5 µm Sn)
Metal surface soldering area (middle layer)
Nickel (1.3 µm - 3 µm Ni)
Color (Housing)
black (9005)
Insulating material
PA
Insulating material group
IIIa
CTI according to IEC 60112
250
Flammability rating according to UL 94
V0
Glow wire flammability index GWFI according to EN 60695-2-12
850
Glow wire ignition temperature GWIT according to EN 60695-2-13
775
Temperature for the ball pressure test according to EN 60695-10-2
125 °C
Width [w]
9.01 mm
Height [h]
11.2 mm
Length [l]
7.25 mm
Installed height
9.2 mm
Solder pin length [P]
2 mm
Hole diameter
1.4 mm
Specification
DIN EN 50155 (VDE 0115-200):2022-06
IEC 60068-2-6:2007-12
IEC 60068-2-70:1995-12
IEC 60512-1-1:2002-02
IEC 60512-1-2:2002-02
IEC 60512-13-2:2006-02
IEC 60512-13-5:2006-02
IEC 60512-15-1:2008-05
IEC 60512-3-1:2002-02
IEC 60512-5-1:2002-02
IEC 60512-9-1:2010-03
IEC 60664-1:2007-04
IEC 61373:2010-05
ISO 6988:1985-02
Result
Test passed
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
No files found
ECLASS-13.0
27460201
ECLASS-15.0
27460201
ETIM 10.0
EC002637
GTIN
4046356038218
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