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ME-IO 18,8 DEV-KIT KMGY Housing set
N
0%
2202527

ME-IO 18,8 DEV-KIT KMGY Housing set

Manufactured by
Brand PHOENIX CONTACT
DEV-KIT ME-IO: contains 1 x ME-IO 18,8 housing and pluggable connection technology (HSCH with HSCP), supplied in individual parts
4055626141770
only
available
100+
99999
pcs.
(2026-08-29)
Supply from Phoenix Contact’s warehouse
Product recommended retail price (RRP) is
000
6060 0 € pcs.
All prices without tax
All prices with tax
inquiry
only
available
100+
inquiry
0
2026-08-29
pcs.
Properties
Description
Dimensions
Files
Codes
Recommendation
Material of contact pads for bus connector, galvanic gold (hard gold)
Product type
Stackable housing set
Housing type
DIN rail housing
Multifunctional housings
Housing series
ME-IO
Product family
ME-IO 18,8
Max. number of positions
28 (pitch: 5 mm)
Ventilation openings present
yes
Width
18.9 mm
Height
113.3 mm
Depth
76.5 mm
Depth from top edge of DIN rail
70 mm
PCB thickness
1.4 mm ... 1.8 mm
Color (Housing)
light gray (RAL 7035)
Material
PA
Flammability rating according to UL 94
V0
Max. IP code to attain
IP20
Ambient temperature (operation)
-40 °C ... 105 °C (depending on power dissipation)
Ambient temperature (storage/transport)
-40 °C ... 55 °C
Ambient temperature (assembly)
-5 °C ... 100 °C
Relative humidity (storage/transport)
80 %
Number of PCB holders
1
Type of PCB mount
Latching
Thickness of the PCB
1.4 mm ... 1.8 mm
Mounting type
DIN rail mounting
Length
0
m
Width
0
m
Height
0
m
Weight Net
0
kg
Weight
0
kg
Package
0
kg
Volume
0
No files found
ECLASS-13.0
27190301
ECLASS-15.0
27190301
ETIM 10.0
EC001031
UNSPSC 21.0
31261500
GTIN
4055626141770
Item accessories
0%
ME-IO 18,8/28 TBUS DEV-PCB PCB
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1910 0 €
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ME 18,8 TBUS 1,5/5 VPE1 KMGY DIN rail bus connector
N
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only
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0%
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HSCP-SP 2,5-1U4-7035 PCB connector
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ME-IO 18,8 C 2U 7035 Housing cover
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0%
HSC-LR 7U KIT 2003 Locking
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ME-IO 18,8 B/FE 9U TBUS 7035 Mounting base housing
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2201809 ME-IO 18,8 B/FE 9U TBUS 7035 Mounting base housing
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