Solder pins per potential
Nominal current I<sub>N</sub>
Nominal voltage U<sub>N</sub>
Rated surge voltage (III/3)
Rated surge voltage (III/2)
Note
WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Insulating material group
CTI according to IEC 60112
Flammability rating according to UL 94
Temperature for the ball pressure test according to EN 60695-10-2
Recommendation
Material of contact pads for bus connector, galvanic gold (hard gold)
Specification
DIN 50018:2013-05
IEC 60068-2-27:2008-02
IEC 60068-2-6:2007-12
IEC 60512-1-1:2002-02
IEC 60512-1-2:2002-02
IEC 60512-13-5:2006-02
IEC 60512-5-1:2002-02
IEC 60512-9-1:2010-03
IEC 60664-1:2007-04
Insertion strength per pos. approx.
Withdraw strength per pos. approx.
Tested number of positions
Rated insulation voltage (III/3)
minimum clearance value - non-homogenous field (III/3)
minimum creepage distance (III/3)
Rated insulation voltage (III/2)
minimum clearance value - non-homogenous field (III/2)
minimum creepage distance (III/2)
Impulse withstand voltage at sea level
Contact resistance R<sub>1</sub>
Contact resistance R<sub>2</sub>
Insertion/withdrawal cycles
Corrosive stress
0.2 dm<sup>3 </sup>SO<sub>2 </sub>on 300 dm<sup>3</sup>/40 °C/1 cycle
Power-frequency withstand voltage